在快速創(chuàng)新領(lǐng)域，《高性能聚合物雜志》是一本國(guó)際同行評(píng)議的雜志，出版了高性能聚合物科學(xué)和技術(shù)方面最高質(zhì)量的原創(chuàng)研究。主要關(guān)注液晶聚合物、芳香族聚合物、芳綸、雜環(huán)聚合物、環(huán)氧樹脂、氟聚合物、硅氧烷、功能化聚合物和無(wú)機(jī)聚合物等高性能聚合物的分子結(jié)構(gòu)/加工性/性能關(guān)系。它接受高性能聚合物科學(xué)和技術(shù)方面的文章，主要側(cè)重于高性能聚合物的分子結(jié)構(gòu)/處理能力/性質(zhì)關(guān)系，如液晶聚合物、芳香聚合物、芳烴、環(huán)環(huán)聚合物、環(huán)氧樹脂、氟聚合物、硅氧烷、功能化聚合物和無(wú)機(jī)聚合物。該范圍涵蓋了高性能聚合物的物理、化學(xué)和材料特性的各個(gè)方面，從分子模型延伸到特定應(yīng)用中聚合物的表征和評(píng)估。特別感興趣的應(yīng)用包括復(fù)合材料基體、涂層、粘合劑、纖維、薄膜、薄膜和活性聚合物，這些材料可用于航空航天、化工、能源電子和運(yùn)輸?shù)阮I(lǐng)域。論文將受到聚合物科學(xué)家、化學(xué)家、化學(xué)工程師、分子模型制造者和設(shè)計(jì)師、材料科學(xué)家和加工技術(shù)專家和物理學(xué)家的歡迎。

In a field of rapid innovation, the Journal of High Performance Polymers is an international peer-reviewed journal that publishes the highest quality original research in high performance polymer science and technology. With a principal focus on molecular structure/processability/property relationships of high performance polymers such as liquid crystalline polymers, aromatic polymers, aramids, hetercyclic polymers, epoxy resin, fluoropolymers, siloxanes, functionalized polymers and inorganic polymers.It accepts articles in high performance polymer science and technology, with a principal focus on molecular structure/processability/property relationships of high performance polymers such as liquid crystalline polymers, aromatic polymers, aramids, hetercyclic polymers, epoxy resin, fluoropolymers, siloxanes, functionalized polymers and inorganic polymers.The scope covers all aspects of the physics, chemistry and material properties of high performance polymers, extending from molecular modelling through to the characterization and evaluation of polymers for specific applications.Applications of particular interest include composite matrices, coatings, adhesives, fibres, films, membranes and active polymers for potential use in sectors such as aerospace, chemicals, energy electronics and transportation. Papers will be welcomed from polymer scientists, chemists, chemical engineers, molecular modellers and designers, materials scientists and processing technologists and physicists.