材料特性描述以原始文章為特色，并對材料結構和性能的理論和實踐方面進行了最新評論。該雜志關注所有的表征技術，包括所有形式的顯微鏡（光、電子、聲學等）和分析（特別是微觀分析和表面分析技術）。這一廣泛技術的發展及其在材料微觀結構定量化中的應用是本雜志的重要方面。該雜志為材料科學家/工程師提供了許多類型材料的最新信息，其基本主題是用新穎的方法解釋材料的行為。期刊所涵蓋的材料包括：金屬及合金陶瓷納米材料生物醫用材料光學材料復合材料天然材料有機材料請注意，并非所有主題都屬于材料表征的范圍。以下所列主題的提交將不被考慮出版，括號中指出了潛在的替代期刊：i）薄膜半導體（固體薄膜；半導體加工材料科學）ii）聚合物或聚合物復合材料（Elsevier聚合物標題；復合材料結構）iii）機械、電氣或其他性能測量，無任何附帶的微觀結構特征（根據重點，請考慮提交腐蝕科學；磨損；材料科學與工程B；材料與設計）iv）沒有附帶微觀結構表征組件的計算、理論或分析論文（計算材料科學；材料科學與工程A；材料科學與工程B；材料科學與工程C）

Materials Characterization features original articles and state-of-the-art reviews on theoretical and practical aspects of the structure and behaviour of materials.The Journal focuses on all characterization techniques, including all forms of microscopy (light, electron, acoustic, etc.,) and analysis (especially microanalysis and surface analytical techniques). Developments in both this wide range of techniques and their application to the quantification of the microstructure of materials are essential facets of the Journal.The Journal provides the Materials Scientist/Engineer with up-to-date information on many types of materials with an underlying theme of explaining the behavior of materials using novel approaches. Materials covered by the journal include:Metals & AlloysCeramicsNanomaterialsBiomedical materialsOptical materialsCompositesNatural MaterialsOrganic materialsPlease note that not all topics fall within the scope of Materials Characterization. Submissions focused on the topics listed below will not be considered for publication, potential alternative journals are indicated in brackets:i) thin film semiconductors (Thin Solid Films; Materials Science in Semiconductor Processing)ii) polymers or polymer composites (Elsevier polymer titles; Composites structures)iii) mechanical, electrical or other property measurements without any accompanying microstructural characterization (depending on the focus, please consider submitting to Corrosion Science; Wear; Materials Science & Engineering B; Materials & Design)iv) computation, theory or analysis papers without an accompanying microstructural characterization component (Computational Materials Science; Materials Science & Engineering A; Materials Science & Engineering B; Materials Science & Engineering C)