傳感器和執(zhí)行器A-物理將多學(xué)科的興趣集中在一本雜志上，該雜志專門傳播關(guān)于固態(tài)傳感器研究和開(kāi)發(fā)的各個(gè)方面的信息。傳感器和執(zhí)行器A：物理部定期向編輯發(fā)布原始論文、信件，并在以下設(shè)備區(qū)域不時(shí)邀請(qǐng)?jiān)u論文章：?基礎(chǔ)和物理，如：效應(yīng)分類、物理效應(yīng)、測(cè)量理論、傳感器建模、測(cè)量標(biāo)準(zhǔn)、測(cè)量誤差、單位和常數(shù)、時(shí)間和頻率測(cè)量。建模論文應(yīng)該把新的建模技術(shù)帶到這個(gè)領(lǐng)域，并得到實(shí)驗(yàn)結(jié)果的支持。?材料及其加工，如：壓電材料、聚合物、金屬氧化物、III-V和II-VI半導(dǎo)體、厚膜和薄膜、光學(xué)玻璃纖維、非晶、多晶和單晶硅。?光電傳感器，例如：光伏二極管、光電導(dǎo)體、光電二極管、光電晶體管、正電子敏感光電探測(cè)器、光電隔離器、光電二極管陣列、電荷耦合器件、發(fā)光二極管、注入激光器和液晶顯示器。?機(jī)械傳感器，例如：金屬、薄膜和半導(dǎo)體應(yīng)變計(jì)、擴(kuò)散硅壓力傳感器、硅加速度計(jì)、固態(tài)位移傳感器、壓電連接裝置、壓電場(chǎng)效應(yīng)傳感器（PIFET）、隧道二極管應(yīng)變傳感器、表面聲波裝置、硅微機(jī)械開(kāi)關(guān)，固態(tài)流量計(jì)和電子流量控制器。?熱傳感器，例如：鉑電阻、熱敏電阻、二極管溫度傳感器、硅晶體管溫度計(jì)、集成溫度傳感器、PTAT電路、熱電偶、熱電堆、熱電溫度計(jì)、石英溫度計(jì)、功率晶體管和厚膜熱打印頭。?磁傳感器，例如：磁電阻、Corbino磁盤、磁二極管、霍爾效應(yīng)設(shè)備、集成霍爾設(shè)備、硅耗盡層磁強(qiáng)計(jì)、磁注入晶體管、放大鏡、橫向磁晶體管、載流子域磁強(qiáng)計(jì)、MOS磁場(chǎng)傳感器、固態(tài)讀寫磁頭。?微觀機(jī)械，例如：關(guān)于執(zhí)行器、結(jié)構(gòu)、集成傳感器執(zhí)行器、微系統(tǒng)以及尺寸從毫米到亞微米的其他設(shè)備或子設(shè)備的研究論文；微觀機(jī)電一體化；微電子機(jī)械系統(tǒng)；微光機(jī)械系統(tǒng)；微機(jī)械系統(tǒng)；微機(jī)器人；硅和非硅織物操作技術(shù)；對(duì)微機(jī)械感興趣的物理現(xiàn)象的基礎(chǔ)研究；微系統(tǒng)分析；與微機(jī)械相關(guān)的新課題和材料的探索；與微系統(tǒng)相關(guān)的問(wèn)題，如電源和信號(hào)傳輸、與微系統(tǒng)相關(guān)的模擬工具；其他微機(jī)械感興趣的課題。?接口電子：設(shè)計(jì)用于直接與上述傳感器接口的電子電路，用于改善或補(bǔ)充這些設(shè)備的特性，如線性化、A/D轉(zhuǎn)換、溫度補(bǔ)償、光強(qiáng)補(bǔ)償、電流/頻率轉(zhuǎn)換和微機(jī)集成。表面處理。?傳感器系統(tǒng)和應(yīng)用，例如：傳感器總線、多傳感器系統(tǒng)、傳感器網(wǎng)絡(luò)、投票系統(tǒng)、遙測(cè)、傳感器陣列以及汽車、環(huán)境、監(jiān)測(cè)和控制、消費(fèi)者、醫(yī)療、警報(bào)和安全、機(jī)器人、航海、航空和航天測(cè)量系統(tǒng)。

Sensors and Actuators A-Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:? Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.? Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.? Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.? Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.? Thermal sensors, such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.? Magnetic sensors, such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices, integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.? Micromechanics, such as: research papers on actuators, structures, integrated sensors-actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems like power supplies and signal transmission, microsystem-related simulation tools; other topics of interest to micromechanics.? Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/frequency conversion and microcomputer interfacing.? Sensor Systems and Applications, such as: sensor buses, multiple-sensor systems, sensor networks, voting systems, telemetering, sensor arrays, and automotive, environmental, monitoring and control, consumer, medical, alarm and security, robotic, nautical, aeronautical and space measurement systems.